Components

Rugged Embedded Transceivers 

Families of optical embedded transceivers that are extremely rugged and deliver bandwidth in excess of 120 Gbps in a chip size part. 

• BW: 120/40 Gbps
• Link budget: greater than 13 dB
• Receiver sensitivity: -12dBm
• BER: 10-12
• Reach: greater than 300 m
• Radiation Resistant Transceivers

RF and Microwave Filters 

Advanced, high quality “state-of-the art” RF Filters, Multiplexers, Switched Filter Banks and Integrated assemblies, from 30 MHz to 51 GHz. 

• Planar X Series thick film process technology on various dielectric substrates.
• Cavity filters
• Ceramic Filters
• Discrete Filter
• RF Filters and Diplexers
• Band Pass Filters

3D Microelectronic Products

The world-leading supplier of advanced high-density 3D microelectronic products, bare die and wafer level stacking technology meeting the demand for high reliability

• Memories and IP cores
• Computer Cores
• Radiation Protection ICs
• Radiation Protection Camera Heads
• Custom System-In-Package (SiP) solutions

GaN Power Semiconductors 

Revolutionary high-reliability radiation-hardened enhancement-mode gallium nitride
power management solutions for Space and other harsh environments.

• Rad Hard GaN Packaged Discretes
• Rad Hard GaN Die on Ceramic Adaptor
• Rad Hard GaN Drivers and Power Stages

Electromechanical Relays

Teledyne Relays offers reliable, compact, surface mountable & th​rough-hole Electromechanical relays designed for use within disparate industries. Teledyne produces Electromechanical Relays for RF, Military, high-performance, and commercial applications.

• DC to 18GHz
• Thru hole & Surface mount
• SPDT, DPDT
• Latching & non-latching
• Solid State & Electromechanical
  

High Reliability Passive Components

Exxelia product portfolio includes wide ranges of capacitors, magnetics, resistors, filters, position sensors, slip rings and high-precision mechanical parts. 

• Capacitors
• Filters
• Magnetics
• Materials & Tuning Components
• Position Sensors
• Slip Rings & Rotary Joint
• Custom Designs

RF/Microwave Resistive & Signal Distribution Components

Board-level components incorporating advanced resistive and signal distribution technologies for a broad range of frequency spectrum applications. 

• Temperature Variable Attenuators
• Surface Mount Chip Resistors and Terminations
• Surface Mount Chip Equalizers
• Diamond RF Resistives®
• Thermopad®

SPDT, ​Multi-Throw, Transfer, 2P3T, Low-PIM, ​& 3-State Switches

Teledyne’s line of SPDT, 2P3T, SP3T, SP4T, SP6T, SP8T, or SP10T multi-throw, Low-PIM, and transfer switches are designed for use across broad applications. DC - ​53GHz bandwidth, low insertion loss, high isolation, and high repeatability.

• Latching/Failsafe
• Standard Switch Matrix
• Custom Switch Matrix