News and Events

York, Pennsylvania - Sciens Innovations introduced their new MORA Development Box. The 7.8 lb. system housed in 14" x 13.25" x 4.1" chassis simplifies the process of creating RF signal processing capabilities and expedites the integration of existing applications within the MORA space. The system is equipped with industry standard RF Input/Output features (channels, bandwidth, tuning, sampling), Network Interfaces and Open Standard Compliance, MORA 2.4 (and future versions) and VITA 49.2 (upon request). Optional features are MORA Explorer GUI and MSRP Generator GUI. 

Exxelia is a manufacturer of complex passive components and precision subsystems focusing on highly demanding end-markets, applications and functions. Exxelia product portfolio includes wide ranges of capacitors, inductors, transformers, resistors, filters, position sensors, slip rings and high-precision mechanical parts serving numerous leading industrial areas such as aerospace, defense, medical, rail, energies and telecommunications.

Eagle Sales will have sales & marketing responsibility in the Mid-Atlantic states.

In this webcast, thermal-management experts detail methods for reducing heat and thermals in modern military electronic systems.

Steve Gudknecht of LCR Embedded Systems will discuss thermal design strategies that ensure the highest level of performance in new and evolving defense applications using advanced air and liquid cooling approaches in integrated systems and chassis.

• Review the VITA 66.5 and SOSA standards specifying embedded, military sensing and computing systems based on a new type of active, optical backplane.
• Discuss optical backplane alternatives consisting of 10 and 25 Gbps transmitter, receiver and transceiver plug-in modules that meet the stringent VITA 66.5 requirements for form factor and performance in a ruggedized environment, enabling the next generation of OpenVPX systems for defense platforms.
• Address the benefits of optical backplane’s improvements in lifecycle management, maintenance, and SWaP (size/weight/power) to ruggedized airborne, ground, and naval platforms.