Components
Rugged Embedded Transceivers & RF/Microwave Resistive & Signal Distribution Components
Families of optical embedded transceivers that are extremely rugged and deliver bandwidth in excess of 120 Gbps in a chip size part.
- BW: 120/40 Gbps
- Link budget: greater than 13 dB
- Receiver sensitivity: -12dBm
- BER: 10-12
- Reach: greater than 300 m
- Radiation Resistant Transceivers
Board-level components incorporating advanced resistive and signal distribution technologies for a broad range of frequency spectrum applications.
- Temperature Variable Attenuators
- Surface Mount Chip Resistors and Terminations
- Surface Mount Chip Equalizers
- Diamond RF Resistives®
- Thermopad®
3D Microelectronic Products
The world-leading supplier of advanced high-density 3D microelectronic products, bare die and wafer level stacking technology meeting the demand for high reliability
- Memories and IP cores
- Computer Cores
- Radiation Protection ICs
- Radiation Protection Camera Heads
- Custom System-In-Package (SiP) solutions
Electromechanical Relays & SPDT, Multi-Throw, Transfer, 2P3T, Low-PIM, & 3-State Switches
Teledyne Relays offers reliable, compact, surface mountable & through-hole Electromechanical relays designed for use within disparate industries. Teledyne produces Electromechanical Relays for RF, Military, high-performance, and commercial applications.
- DC to 18GHz
- Thru hole & Surface mount
- SPDT, DPDT
- Latching & non-latching
- Solid State & Electromechanical
Teledyne’s line of SPDT, 2P3T, SP3T, SP4T, SP6T, SP8T, or SP10T multi-throw, Low-PIM, and transfer switches are designed for use across broad applications. DC - 53GHz bandwidth, low insertion loss, high isolation, and high repeatability.
- Latching/Failsafe
- Standard Switch Matrix
- Custom Switch Matrix
